JOIN US
E-PAPER
Home
Elections
India
Karnataka
Opinion
World
Business
Sports
Entertainment
Video
IPL
News Shots
Explainers
Bengaluru
Science
Trending
Brandspot
Photos
Newsletters
Home
News Shots
Trending
Menu
×
ADVERTISEMENT
ADVERTISEMENT
Scalable Modular Interconnect for Three-dimensional High-Performance Application
Patent granted for NMAMIT’s ‘SMITHA’
The invention ‘Scalable Modular Interconnect for Three-dimensional High-Performance Application (SMITHA) - A new 3D topology for noc-based systems’ of Dr Niranjan N Chiplunkar has been granted a patent by Indian Patent Office recently.
16 June 2020, 14:22 IST
Patent granted for NMAMIT’s ‘SMITHA’
16 June 2020, 14:22 IST